Wire Bonder

Description

A thermosonic ball-wedge wire bonder used to create electrical interconnections between wire leads and semiconductor, hybrid, or microwave devices. It is designed to bond gold wires ranging from 0.0007” (18 µm) to 0.002” (54 µm) in diameter using a ball-to-wedge bonding process that combines ultrasonic energy and heat. In operation, the wire is fed vertically through a hollow capillary, where an electric discharge forms a ball at the wire tip. The first bond is created using the ball, followed by a wedge bond formed under the capillary tool. The bonding process is manually controlled by the operator, who uses visual alignment through a microscope to position and guide the tool for precise bonding.

Capabilities

• Thermosonic ball-wedge bonding – Uses a combination of heat and ultrasonic energy for reliable wire interconnections 
• Gold wire compatibility (0.0007”–0.002”) – Supports a range of fine wire diameters for microelectronics applications 
• Ball formation via electric discharge – Automatically forms a ball at the wire tip to initiate bonding 
• Capillary-based wire feed system – Enables vertical wire feeding with independent control 
• Manual operation with microscope guidance – Allows precise visual alignment and bonding by the operator 
• Ball-to-wedge bonding technique – Creates secure first (ball) and second (wedge) bonds for electrical connectivity 
• Flexible device compatibility – Can be used on any device that fits under the microscope for bonding operations

Related Equipment

DYNACOOL PPMS