Leica TXP Microscopy Sample Preparation System

Description

The Leica TXP Microscopy Sample Preparation System is designed for precise cutting and polishing of samples prior to ion milling or ultramicrotomy. It features an integrated stereomicroscope and ring LED illumination, enabling real-time observation and accurate distance measurement during preparation. The system supports multiple preparation techniques—such as sawing, milling, grinding, and polishing—at speeds ranging from 300 to 20,000 rpm, all without removing the sample from its holder.

Capabilities

• Tungsten carbide milling tool – Enables efficient and durable material removal 
• Diamond, SiC, and neoprene polishing foils – Provide high-quality surface finishing options 
• Adjustable spindle speed (300–20,000 rpm) – Offers precise control with 100 rpm increments 
• Diamond core drilling clamping mechanism – Ensures stable and accurate drilling 
• Maximum sample size: 60 mm² – Accommodates moderately sized specimens 
• Pivot arm (0°–60° range) – Allows flexible viewing angles during preparation 
• Manual feed wheel (0.5–100 µm steps) – Enables fine, controlled sample advancement

Related Equipment

• Cryo-ultramicrotome
• Talos TEM
• Axia Chemi SEM
• JEOL SEM
• Scios 2 Dual Beam SEM